Hi there - We are excited to share a recent customer success story with you.
LXI High-density Matrix Modules Selected for Opens and Shorts Testing of Semiconductor Packages
The Customer:
Amkor Technology is one of the world’s largest providers of contract semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 300 of the worlds leading semiconductor companies and electronics OEMs.
The Application:
Amkor’s Korean division was specifying a new test system — one section of the system was to be used for opens and shorts testing for semiconductor packages. A large matrix was defined for the task — a 3072x4 matrix switch configuration to perform 4-wire measurement, I/V characterization, as well as 2-wire measurement. As it is with many test applications, it needed to be acquired at the lowest price with the highest performance as possible.
The Solution:
After researching their options, Amkor decided to use three Pickering Interfaces LXI high-density matrix modules (model 60-553-008). These LXI matrix modules had the type of EMRs needed to provide the lowest price in the market as well as allow up to 1027 simultaneously closed crosspoints.
Pickering Interfaces LXI High-density Matrix (model 60-553-008)
Additionally, from the viewpoint of Testmation, the selected test system integrator, this LXI matrix module includes Pickering’s BIRST (Built-In-Relay-Self-Test) function, which made it the preferred choice for easy and quick maintenance support.
Amkor's New Test System with up-close view of LXI matrices inside tester
Background on Opens and Shorts Testing:
Below is some background on opens and shorts testing, also called structural test and why Pickering’s LXI Matrix Module was the best choice for Amkor’s application.
Opens and shorts testing is the most generally used way for evaluating and verifying a semiconductor package prior to functional test. In addition to the test, it can also be used in failure analysis of the package where I/V characterization tests are implemented.
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